Ceramic Substrate Wiki
A ceramic material is an inorganic non metallic often crystalline oxide nitride or carbide material.
Ceramic substrate wiki. Co fired ceramic devices are monolithic ceramic microelectronic devices where the entire ceramic support structure and any conductive resistive and dielectric materials are fired in a kiln at the same time. The materials and products are described in this article. Among the ceramics employed as electronic substrates and packages the dominant material is alumina aluminum oxide al. Mcm c ceramic substrate mcms such as low temperature co fired ceramic ltcc the pcb that interconnects the chiplets is known as an interposer.
The thickness of the ceramic substrate determines the resonant frequency of the device. This application of heat causes irreversible changes in within the clay body rendering the form permanent. Typical devices include capacitors inductors resistors transformers and hybrid circuits the technology is also used for robust assembly and packaging of electronic components multi. Ceramics can take the form of pottery utilitarian vessels sculpture casting cores for bronzes or architectural elements such as tiles pipes and bricks.
Substrate may refer to. Ceramics are objects made from clay or clay mixed with other materials that are subjected to high heat. They withstand chemical erosion that occurs in other materials subjected to acidic or caustic environments. Ceramic resonators are made of high stability piezoelectric ceramics generally lead zirconium titanate which functions as a mechanical resonator in operation mechanical vibrations induce an oscillating voltage in the attached electrodes due to the piezoelectricity of the material.
Ceramic is the name for some materials that are formed by the use of heat the word ceramic comes from the greek word κεραμικός keramikos chemically it is an inorganic compound of metal non metal or metalloid atoms held together by chemical bonds. Some elements such as carbon or silicon may be considered ceramics ceramic materials are brittle hard strong in compression and weak in shearing and tension. The insulating properties of ceramics are well known and these properties have found application in advanced ceramic materials for substrates and packages. This is often either organic pcb used in amd s zen 2 microarchitecture or is made of silicon as in high bandwidth memory 6 both have their advantages and limitations.